Tag • #packaging

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The fake Suffolk supermarket tackling problem plastic

news.movim.eu / TheGuardian · Saturday, 10 February - 08:00

DS Smith’s innovation lab is in the spotlight after the packaging firm’s takeover approach from rival Mondi

With its colourful fruit and veg display and shelves filled with groceries it could be your local supermarket, but this is a play shop for adults and there is only one thing missing: plastic.

Well, problem plastic. The mock store is the secret innovation lab of DS Smith, the FTSE 100 paper and packaging firm where major retailers and brands trek to see its big ideas to replace the plastic ready meal containers, fruit punnets and shrink-wrap consumers use every day.

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New chip-packaging facility could save TSMC’s Arizona fab from “paperweight” status

news.movim.eu / ArsTechnica · Thursday, 30 November - 19:25 · 1 minute

Enlarge / Apple wants to build more of its A- and M-series chips in the United States. (credit: Apple)

Late last year, Apple CEO Tim Cook announced that the company would definitely be buying chips made at Taiwan Semiconductor's new Arizona-based fab once it had opened. Apple working with TSMC isn't new; most, if not all, of the processors currently sold in Apple's products are made on one of TSMC's many manufacturing nodes. But being able to buy them from a US-based facility would be a first.

The issue, as outlined by some TSMC employees speaking to The Information in September , is that the Arizona facility would manufacture chips, but it wouldn't be building a facility to handle packaging. And without packaging, the Arizona factory would essentially be a "paperweight," requiring any chips made there to be shipped to Taiwan for assembly before they could be put in any products.

Today Apple announced that it had solved that particular problem, partnering with a company called Amkor to handle chip packaging in Arizona. Amkor says that it will invest $2 billion to build the facility, which will "employ approximately 2,000 people" and "is targeted to be ready for production within the next two to three years." Apple says that it has already worked with Amkor on chip packaging for "more than a decade."

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Parameterizing GitLab CI/CD?

pubsub.slavino.sk / icinga · Thursday, 24 March, 2022 - 13:00 edit

While doing packaging for Icinga, I noticed we have a lot of YAML files describing GitLab pipelines doing very similar jobs. The same build job across different operating systems. That’s wasteful behaviour, which leads to a bigger workload when it comes to modifying these jobs. Tasks like adding new versions and especially adding new operating […]

The post Parameterizing GitLab CI/CD? appeared first on Icinga .

Značky: #gitlab, #json, #Network, #Development, #packaging, #How-tos, #jsonnet