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    CPU : l’impressionnante montée en puissance du premier fondeur chinois

    news.movim.eu / JournalDuGeek · Wednesday, 31 August - 15:30

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Avec ses puces gravées en 7nm, Semiconductor Manufacturing International Corp (SMIC) joue désormais dans la cour des grands.

CPU : l’impressionnante montée en puissance du premier fondeur chinois

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    TSMC s’inquiète des conséquences d’une invasion de Taïwan par la Chine

    news.movim.eu / JournalDuGeek · Wednesday, 3 August - 13:00

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Le roi incontesté et incontestable des semi-conducteurs explique que son activité serait dévastée en cas de conflit armé.

TSMC s’inquiète des conséquences d’une invasion de Taïwan par la Chine

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    TSMC est dans les temps, la gravure en 3nm débarque cette année

    news.movim.eu / JournalDuGeek · Tuesday, 19 April - 16:30

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Les premières puces gravées en 3nm devraient arriver cette année chez TSMC; une date qui marquera le début d'une guerre sans merci entre titans du hardware.

TSMC est dans les temps, la gravure en 3nm débarque cette année

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    Classement des fondeurs : TSMC domine de la tête et des épaules

    news.movim.eu / JournalDuGeek · Friday, 18 March, 2022 - 17:00

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TSMC éclipse largement Samsung et le reste de ses concurrents et conserve sa place de leader du classement des fondeurs avec une avance considérable.

Classement des fondeurs : TSMC domine de la tête et des épaules

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    Intel, AMD, and other industry heavyweights create a new standard for chiplets

    news.movim.eu / ArsTechnica · Wednesday, 2 March, 2022 - 20:56 · 1 minute

A sample chiplet design, with the CPU dies made with a more advanced manufacturing process and the chipset and some other functions made on older, cheaper processes.

Enlarge / A sample chiplet design, with the CPU dies made with a more advanced manufacturing process and the chipset and some other functions made on older, cheaper processes. (credit: Universal Chipset Interconnect Express)

Some of the CPU industry's heaviest hitters—including Intel, AMD, Qualcomm, Arm, TSMC, and Samsung—are banding together to define a new standard for chiplet-based processor designs. Dubbed Universal Chiplet Interconnect Express (UCIe for short), the new standard seeks to define an open, interoperable standard for combining multiple silicon dies (or chiplets) into a single package.

Intel, AMD, and others are already designing or selling chiplet-based processors in some form—most of AMD's Ryzen CPUs use chiplets, and Intel's upcoming Sapphire Rapids Xeon processors will, too. But these chips all use different interconnects to enable communication between chiplets. The UCIe standard, if it succeeds, will replace those with a single standard, in theory making it much easier for smaller companies to take advantage of chiplet-based designs or for one company to include another company's silicon in its own products.

Chiplet-based designs are advantageous when making large chips on cutting-edge manufacturing nodes partly because they cut down on the amount of silicon manufacturers need to throw out. If a manufacturing defect affects one CPU core, tossing (or binning) a single 8-core chiplet is a whole lot cheaper than having to toss a huge 16- or 32-core processor die. Chiplet designs also let you mix-and-match chips and manufacturing processes. You could, for example, use an older, cheaper process for your chipset and a newer, cutting-edge process for your processor cores and cache. Or you could put an AMD GPU on the same package as an Intel CPU .

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    Intel’s strategy for outflanking Arm takes shape with bet on RISC-V

    news.movim.eu / ArsTechnica · Wednesday, 9 February, 2022 - 18:06

Intel’s strategy for outflanking Arm takes shape with bet on RISC-V

Enlarge (credit: ony Avelar/Bloomberg )

Many of Intel’s current woes can be traced to the fact that the company was left out of the iPhone. Whether Intel passed on the opportunity or couldn’t meet the spec is by now a moot point, but missing out on the smartphone revolution—and its billions of chips—played no small part in the company falling behind the leading edge .

Now, Intel is ponying up $1 billion in an attempt to avoid repeating history.

The company announced an “innovation fund” this week that places bets on a couple of key technologies, chief among them RISC-V, a free, open source instruction set that shows promise in low-power and embedded systems, markets that are expected to grow significantly over the next several years.

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    Intel va construire une immense usine à 20 milliards de dollars

    news.movim.eu / JournalDuGeek · Wednesday, 26 January, 2022 - 19:00

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Intel espère que le "plus grand site de production de puces de la planète" permettra aux États-Unis de récupérer la mainmise sur ce marché stratégique.

Intel va construire une immense usine à 20 milliards de dollars

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    TSMC invests in new capacity despite forecasts chip demand will ease

    news.movim.eu / ArsTechnica · Thursday, 13 January, 2022 - 14:17

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Enlarge / TSMC Fab 16. (credit: TSMC)

Taiwan Semiconductor Manufacturing Company plans to raise its capital expenditure by almost a third this year as the world’s largest contract chipmaker defies analyst warnings of softening demand for technology gadgets.

TSMC expects capital expenditure to reach $44 billion this year, a 32 percent increase from the $30 billion spent in 2021 and triple the amount in 2019, the company said on Thursday.

The push underscores the outsized role semiconductors are coming to play in goods far beyond classical electronics products, from cars to factory equipment. It also reflects TSMC’s dominance of global chip manufacturing.

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